Details
Qualitek 825HF - No Clean Lead Free Solder Paste, Halogen Free
The 825HF No Clean Lead Free Solder Paste has a unique flux system designed specifically for high temperature lead free alloys. It provides the fluxing activity levels that promote thermal stability and prevents thermal degradation when reflowing under air atmosphere (normal). Since use of nitrogen is not required, 825 Lead Free Solder paste will provide excellent cost savings.
In addition, 825 Lead Free solder paste exhibits superior joint strength, excellent wettability, extraordinary print definition and tack life. The post soldering residues of 825 are non-conductive, non-corrosive and highly insulated.
825 Features:
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Exceptionally high activity for improved solderability
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Consistant high quality print definition
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High print speeds up to 150mm per second
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Shiny and bright solder joints
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Medium soft non-cracking residues
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Pin testable and non-conductive residues
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Non-corrosive and highly insulated residues
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Flux classification ROL0 to JSTD-004
Alloy:
LF965-30 - SAC305 (Sn96.5/Ag3.0/Cu0.5)
Type 3 (25-45um)
Type 4 (20-38um)
Additional Information
SKU | Q-825HF |
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Manufacturer | No |