Details
QUICK EA-H05 IR BGA REWORK SYSTEM:
Specifications:
IR Infrared Rework System
Model | EA-H05 |
General power | 1600Watt(max) |
Power of bottom heater | 400W*2=800Watt(Dark infrared heating plate) |
Power of top heater | 180W*4=720Watt (Infrared heating tube, wavelength about 2-8μm) |
Size of top heater | 60*60mm |
Size of bottom heater | 135*250mm |
Range of top heater | 20-60mm(X, Y direction both adjustable) |
Vacuum pump | 12V/300mA, 0.05Mpa(max) |
Top cooling fan | 12V/300mA, 15CFM |
Laser alignment tube | 3V/30mA |
Movable motor | 24V DC/100mA |
Movable arm range | 93mm |
Max PCB size | 400mm*400mm |
Dimensions | 750(L)×500(W)×680(H)mm |
Soldering station | Intelligent digital lead free soldering station |
Soldering power | 90Watt |
Communication | RS-232C(connect with PC) |
Infrared temperature sensor | 0-300℃(Testing range) |
External K-type sensor | Optional |
Weight | About 35kg |
PL Precision Placement System of BGA Rework System
Model | PL |
Power | About 15Watt |
Camera | 22*10 times magnifying; 12V/300mA Horizontal resolution: 480 lines; PAL format |
Lens size | 40mm*40mm |
Size of BGA to be aligned | 40mm*40mm |
Vacuum pump | 12V/600mA 0.05Mpa(max) |
Camera output signal | Video Signal |
Weight | 22kg |
RPC Reflow Soldering Process Camera
Model | RPC |
Power | About 15Watt |
Camera | 22*10 times magnifying; 12V/300mA; Horizontal resolution: 480 lines; PAL format |
Main parts of BGA Rework System:
1. Infrared heating system
Open-type dark infrared heating, non-contact infrared temperature sensor monitors the surface temperature changes of BGA, realize closed-loop control, ensure precise temperature technical window and even heat distribution.
Dark infrared heating technology with 2-8μm long wave can minimize temperature differences to avoid damages resulted from long dipping, cold soldering and overheating.
2. Heating system of BGA Rework System
Bottom dark infrared ceramic heating plate, 800W power; PCB can be preheated evenly and protected from being distorted and damaged. The top heater uses 720W dark infrared heating tube, heating area can be adjusted according to sizes of BGA. When process is over, vacuum will generate automatically to pick up BGA components and return to original position.
3. Soldering Station of BGA Rework System
Intelligent digital soldering station uses high frequency current heating method. It is easy to clean the soldering pad.
4. Nozzles, clamps of BGA Rework System
Special PCBs or PCBs with sockets, connectors can be fixed by the clamps of different lengths.
The nozzles can be selected as per actual sizes of BGA/CSP.
Operating Diagram
Additional Information
SKU | EA-H05 |
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Manufacturer | No |