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QUICK EA-H05 BGA Rework System

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Quick Overview

BGA Rework System, QUICK EA-H05


1. No need of nozzles, no airflow during re-flow process.
2. Use non-contact infrared temperature sensor to measure temperature real-timely, and achieve closed loop control of temperature during rework process, especially suitable for lead free process.
3. By reflecting foil to reduce thermal transmission to adjacent components.
4. Camera of BGA Rework System can be used to monitor the re-flow process.
5. No airflow during the process of BGA re-balling, and the success ratio of BGA re-balling can almost be up to 100%.

QUICK EA-H05 BGA Rework System

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IR Infrared Rework System

Model EA-H05
General power 1600Watt(max)
Power of bottom heater 400W*2=800Watt(Dark infrared heating plate)
Power of top heater 180W*4=720Watt (Infrared heating tube, wavelength about 2-8μm)
Size of top heater 60*60mm
Size of bottom heater 135*250mm
Range of top heater 20-60mm(X, Y direction both adjustable)
Vacuum pump 12V/300mA, 0.05Mpa(max)
Top cooling fan 12V/300mA, 15CFM
Laser alignment tube 3V/30mA
Movable motor 24V DC/100mA
Movable arm range 93mm
Max PCB size 400mm*400mm
Dimensions 750(L)×500(W)×680(H)mm
Soldering station Intelligent digital lead free soldering station
Soldering power 90Watt
Communication RS-232C(connect with PC)
Infrared temperature sensor 0-300℃(Testing range)
External K-type sensor Optional
Weight About 35kg

PL Precision Placement System of BGA Rework System

Model PL
Power About 15Watt
Camera 22*10 times magnifying; 12V/300mA Horizontal resolution: 480 lines; PAL format
Lens size 40mm*40mm
Size of BGA to be aligned 40mm*40mm
Vacuum pump 12V/600mA 0.05Mpa(max)
Camera output signal Video Signal
Weight 22kg

RPC Reflow Soldering Process Camera

Model RPC
Power About 15Watt
Camera 22*10 times magnifying; 12V/300mA; Horizontal resolution: 480 lines; PAL format

Main parts of BGA Rework System:

1. Infrared heating system

Open-type dark infrared heating, non-contact infrared temperature sensor monitors the surface temperature changes of BGA, realize closed-loop control, ensure precise temperature technical window and even heat distribution.

Dark infrared heating technology with 2-8μm long wave can minimize temperature differences to avoid damages resulted from long dipping, cold soldering and overheating.

2. Heating system of BGA Rework System

Bottom dark infrared ceramic heating plate, 800W power; PCB can be preheated evenly and protected from being distorted and damaged. The top heater uses 720W dark infrared heating tube, heating area can be adjusted according to sizes of BGA. When process is over, vacuum will generate automatically to pick up BGA components and return to original position.

3. Soldering Station of BGA Rework System

Intelligent digital soldering station uses high frequency current heating method. It is easy to clean the soldering pad.

4. Nozzles, clamps of BGA Rework System

Special PCBs or PCBs with sockets, connectors can be fixed by the clamps of different lengths.
The nozzles can be selected as per actual sizes of BGA/CSP.

Operating Diagram

Additional Information

Manufacturer No

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