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QUICK BGA2120 BGA Rework System

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Quick Overview

BGA Rework System, QUICK BGA2120


1. BGA rework system can ensure even heat distribution and right peak temperature and realize reliable lead-free soldering. Uses closed loop sensor and hot air top heater, sectional hot air for BGA, infrared heating part for complete PCB to prevent PCB from being deformation.
2. 60*60MM optical alignment lens, alignment of large BGA can still show clearly. Align glass is controlled by motor, and small plate for chips is placed above the glass. Special supporting rods can be placed in frame structure of PCB. The bottom supporting rods of BGA rework system are connected with landscape orientation rods to make sure accordance when place PCB. Fine adjustment of X, Y, Z, θ controlled by rocker, linear precision orbit and precision silk pole. Uses motor to control rough and fine adjustment.
3. Except using manual fine adjustment of X, Y, θ in chip fine alignment, QUICK BGA2120 can automatically control the pick-up, placement and de-soldering of chips, movement of glass and heater, reflow control etc. which is unique in lead-fee rework systems.

QUICK BGA2120 BGA Rework System

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General power 2200W(max)
Power supply 220V/230V AC, 50/60HZ
Top heating power 700W
Bottom heating power 700W
Bottom preheating power 800W
Air speed of side cooling fan ≤3.5m3/min
Hot air temperature 500℃(MAX)
Hot air temperature range 500℃(MAX)
Bottom preheating size 300*300mm
Max PCB size 300*300mm
Chip size 2*2-60*60mm
Placement precision ±0.025mm
Camera 12V/300mA 22*10 times magnifying; Horizontal resolution: 480lines PAL format
LED Light Bottom white LED and top red LED(brightness adjustable)
LCD window 100*75(mm) 16*2 characters
Communication RS-232C(Connect with PC)
Vacuum 12V/300mA, 0.05Mpa(MAX)
External K type sensor 5PCS
Net weight 50kg
Dimension of BGA rework system 600(L)*600(W)*500(H)mm

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