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Solder Paste, Q-862, Lead Free SAC305

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£29.95

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Quick Overview

Qualitek 862 - No Clean Lead Free Solder Paste


The 862 No Clean Lead Free Solder Paste has a unique flux system designed specifically for high temperature lead free alloys. It provides the fluxing activity levels that promote thermal stability and prevents thermal degradation when reflowing under air atmosphere (normal). Since use of nitrogen is not required, 863 Lead Free Solder paste will provide excellent cost savings.


Alloy: LF965-30 - SAC305 (Sn96.5/Ag3.0/Cu0.5)


Powder Sizes:

Type 3 (25-45um) or Type 4 (20-38um)

Solder Paste, Q-862, Lead Free SAC305

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£29.95

Details

Qualitek 862 - No Clean Lead Free Solder Paste

The 862 No Clean Lead Free Solder Paste has a unique flux system designed specifically for high temperature lead free alloys. It provides the fluxing activity levels that promote thermal stability and prevents thermal degradation when reflowing under air atmosphere (normal). Since use of nitrogen is not required, 862 Lead Free Solder paste will provide excellent cost savings.

In addition, 862 Lead Free solder paste exhibits superior joint strength, excellent wettability, extraordinary print definition and tack life. The post soldering residues of 862 are non-conductive, non-corrosive and highly insulated.

Features:
  •  Low Voiding
  •  Excellent wettability
  •  Long tack time
  •  Excellent hot slump resistance
  •  Medium soft non-cracking residues
  •  Extended stencil life

862 is a no clean formulation therefore the residues do not need to be removed. If removal is desired, the use of Everkleen 1005 Buffered Saponifier will aid any residue removal.

Alloy:
LF965-30 - SAC305 (Sn96.5/Ag3.0/Cu0.5)
  • Powder Size:
  • Type 3 (25-45um)
  • Type 4 (20-38um)
  • Additional Information

    SKU Q862
    Manufacturer No

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