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QUICK EA-H15 BGA Rework System

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£14,995.00
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Quick Overview


BGA Rework System, QUICK EA-H15



Features:


 
1. EA-H15 Infrared reflow soldering section of BGA rework system
Infrared temperature sensor monitors BGA surface temperature directly, realize close loop control, ensure precise temperature technical window and even heat distribution.
2. PL Precise aligning and placing system of BGA rework system
Visible double-colors optical lens alignment, overlap alignment between solder ball and soldering pad is scientific and accurate; easy control, and pick-up and placement.
3. RPC Reflow Camera of BGA rework system
The melting process of BGA solder ball can be observed from different angles, provides critical information to get accurate and reliable process curve.
4. IRsoft Software of BGA rework system
The whole process can be recorded, controlled and analyzed and then generate curve diagram by connecting to PC, can meet the demands of modern electronic industry.



QUICK EA-H15 BGA Rework System

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Details

QUICK EA-H15 IR BGA REWORK SYSTEM:

Specifications:

IR Infrared Rework System

Model EA-H15
General power 2800Watt(max)
Power of bottom heater 500W*4=2000Watt or
400W*4=1600Watt(High Infrared heating tube/ Dark Infrared heater optional)
Power of top heater 180W*4=720Watt (Infrared heating tube, wavelength about 2-8μm)
Size of top heater 60*60mm
Size of bottom heater 290*290mm
Range of top heater 20-60mm(X, Y direction both adjustable)
Vacuum pump 12V/300mA, 0.05Mpa(max)
Max. PCB Size
400 x 400mm
Laser alignment tube 3V/30mA
Movable motor 24V DC/100mA
Movable arm range 93mm
Dimensions 850(L)×650(W)×730(H)mm
LCD window 65.7*23.5mm 16*2 characters
Communication RS-232C(connect with PC)
Infrared temperature sensor 0-300℃(Testing Range)
External K-type sensor Optional

PL Precision Placement System

Model PL2015
Power About 15Watt
Camera 22*10 times magnifying; 12V/300Ma Horizontal resolution: 480 lines; PAL format
Lens size 60mm*60mm
Size of BGA to be aligned 60mm*60mm
Vacuum pump 12V/600mA 0.05Mpa(max)
Camera output signal Video Signal
Weight 55Kg

RPC Reflow Soldering Process Camera of BGA rework system

Model RPC2015
Power About 15Watt
Camera 22*10 times magnifying; 12V/300mA; Horizontal resolution: 480 lines; PAL format

Main Parts of BGA Rework System:

Infrared heating system of BGA rework system

Open-type dark infrared heating, non-contact infrared temperature sensor monitors the surface temperature changes of BGA, realize closed-loop control, ensure precise temperature technical window and even heat distribution.

Top heater of BGA rework system

The top heater uses 2-8μm long wave infrared heating tube, 720W, heating area can be adjusted according to sizes of BGA, protect adjacent components from being heated. No need of nozzles, save cost.

Bottom heater of BGA rework system

The bottom heater uses 4 sets of infrared heaters, 2000W, 500W×4, high infrared heating tube. Larger PCBs can be placed and heated evenly, avoid deformation and damage.

Optical lens alignment of BGA rework system

The PL part uses optical lens to align components. Red top light, white bottom light, brightness is adjustable. Light source reflected by lens to ensure BGA solder ball and PCB solder pad in line with each other and even.

The solder ball and pad will show clearly in the monitor through the camera of PL part. By adjusting the X, Y axis fine knob and component control knob, solder ball which displays in red and solder pad which displays in white can overlap completely.

Alignment adjustment of BGA rework system

The most precise alignment can realize by fine adjustment of X, Y, Z angles.
Components aligning knob can make BGA 360° rotating.

PCB fixing of BGA rework system

The flexible PCB supporting rod can fix PCB effectively, absorb the expansion force resulted from heating or cooling, prevent the PCB from distortion.
Special PCB can be fixed by different clamps. The supporting rod can be used for the bottom of large PCB to avoid distortion.


Additional Information

SKU Q-EA-H15
Manufacturer No

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