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QUICK BGA2105 BGA Rework System

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Quick Overview

BGA Rework System, QUICK BGA2105


1. BGA2105 rework system uses excellent heating materials to control the process of BGA soldering and de-soldering process accurately.
2. Large power brushless DC fan, temperature controlled by closed loop sensor and micro computer zero triggering, generate large volume of hot air.
3. Various types of titanium nozzles available, easy replacement.
4. Program can be set to control top and bottom hot air temperature, precise and even.
5. Powerful fan cools bottom heating area rapidly.
6. QUICKSOFT available, easy operation.

QUICK BGA2105 BGA Rework System

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General power 3500W(max)
Power supply 220V AC, 50/60Hz
Power of top heater 700Watt
Power of bottom pre-heater 400Watt*4=1600Watt(Infrared heater)
Power of bottom heater 700Watt
Speed of side cooling fan ≤3.5 m3/min
Temperature range(Hot air) 500℃(Max)
Temperature range(Preheating) 500℃(Max)
Bottom preheating area 330*360mm
Max PCB size 330*360mm
External K-type sensor 3pcs
Communication RS-232C(connect with PC)
Net weight About 23.5kg
Dimensions 610(L)*580(W)*520(H)mm

Nozzles of BGA rework system

Part number Size (mm)
N0707 7*7
N0909 9*9
N1313 13*13
N1515 15*15
Part number Size (mm) Part number Size (mm)
N1818 18*18 N2222 22*22
N2424 24*24 N2626 26*26
N2828 28*28 N3030 30*30
N3232 32*32 N3535 35*35
N3737 37*37 N3939 39*39
N4444 44*44 N4949 49*49
N5252 52*52      

Additional Information

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