Details
QUICK BGA2100 BGA REWORK SYSTEM:
Specifications:
Power supply | 220V AC, 50Hz, 5KW |
Max PCB size | 600*500mm |
Min IC size | 2*2mm |
Max IC size | 60*60mm |
Size of bottom heater | 550*450mm |
LCD window | 100*75mm 16*2 characters |
Mounting Accuracy | ±0.025mm |
Hot air temperature | 500℃(Max) |
Bottom preheating temperature | 500℃(Max) |
Power of top heater | 800Watt |
Power of bottom heater | 800Watt |
Power of bottom infrared pre-heater | 3200Watt |
Speed of side cooling fan | ≤ 3.5m3 /min |
Camera | 12V/300mA 22*10 times magnifying Horizontal resolution: 480 lines PAL format |
Outside K-type sensor | 5 pcs |
Communication | RS-232C(connect with PC) |
Dimensions | 1150(L)*800(W)*800(H)mm |
Weight | About 120kg |
Main Parts of BGA Rework System:
Heating System of BGA rework system
800W hot air power for top and bottom heaters, airflow is stepless. The temperature of main heating area can rise quickly. Heat distributes evenly, decrease the vertical temperature difference between chip surface and soldering joint, shorten the whole process.
Main heater of BGA rework system: top hot air + bottom hot air
Seven temperature areas, air volume, temperature and heating time of both top and bottom heaters can be adjusted as per requirements. Accurate temperature and even heat distribution can ensure the precision and flexibility of the process.
External 5 K-type sensors, can monitor temperature of PCB and BGA accurately.
Pick-up chips of BGA rework system
Vacuum will generate automatically and pick up BGA chips when the process is finished, then the vacuum will return to original position.
Additional Information
SKU | BGA2100 |
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Manufacturer | No |