Details
The SAR-1400-L with manual loading and unloading, equipped with a laser cutting device
With the growing trend towards miniaturization and the use of highly sensitive components, there is increasing demand for completely dust-free and stress-free cutting of PCBs from the multi panel.
The stand-alone depanelling system SAR-1400-L provides an ideal solution.
Special features of laser depanelling:
Laser depanelling has significant advantages over conventional cutting processes:
- Contactless cutting process means stress-free cutting
- Dust-free environment
- Clean, smooth edges as no glass fiber residue is formed
- Very high contour accuracy
- Shorter tooling times mean high availability
- Lower equipment costs (low number of wearing parts)
- Scope for modifying multi panel layout, so less material waste
The GAS laser cutting process - good all round
In addition to the familiar benefits of the laser cutting process, the GAS technology of the SAR-1400-L also offers the following advantages:
- Low equipment costs due to simple design of individual worktable
- High productivity thanks to:
: Low cycle times achieved by fast, precise linear motor axes
: Multi panel change cycle of < 2 s
: Double loading area - Optimum extraction technology
- Generous working space
Additional Information
| SKU | SAR-1400-L |
|---|---|
| Manufacturer | No |
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