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QUICK BGA2100 BGA Rework System

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Availability: In stock

£23,995.00
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Quick Overview


BGA Rework System, QUICK BGA2100



Features:


1. High automatization, the de-soldering, pick-up and placement of chips can be finished by one button, easy operation.
2. Use large power brushless DC fan, closed loop of sensor and micro-computer zero triggering, can generate large volume of hot air. No need for external air supply, easy operation.
3. Seven temperature areas, suitable for reflex BGA, multilayer BGA and metal shielding case.
4. Integrative design, combines heating system and alignment system together.
5. Visible double-colors optical lens alignment, controlled by rocker, clear and precise.
6. Large power fan, speed adjustable, cool bottom heating area quickly.
7. QUICKSOFT interface, with operation right limitation and profile analysis function available. Can analyze preheating speed, peak temperature, temperature preserving time and cooling rate effectively.
8. Various types of titanium alloy hot air nozzles available, easy replacement.









QUICK BGA2100 BGA Rework System

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Details

QUICK BGA2100 BGA REWORK SYSTEM:

Specifications:

Power supply 220V AC, 50Hz, 5KW
Max PCB size 600*500mm
Min IC size 2*2mm
Max IC size 60*60mm
Size of bottom heater 550*450mm
LCD window 100*75mm 16*2 characters
Mounting Accuracy ±0.025mm
Hot air temperature 500℃(Max)
Bottom preheating temperature 500℃(Max)
Power of top heater 800Watt
Power of bottom heater 800Watt
Power of bottom infrared pre-heater 3200Watt
Speed of side cooling fan ≤ 3.5m3 /min
Camera 12V/300mA 22*10 times magnifying Horizontal resolution: 480 lines PAL format
Outside K-type sensor 5 pcs
Communication RS-232C(connect with PC)
Dimensions 1150(L)*800(W)*800(H)mm
Weight About 120kg

Main Parts of BGA Rework System:

Heating System of BGA rework system

800W hot air power for top and bottom heaters, airflow is stepless. The temperature of main heating area can rise quickly. Heat distributes evenly, decrease the vertical temperature difference between chip surface and soldering joint, shorten the whole process.

Main heater of BGA rework system: top hot air + bottom hot air

Seven temperature areas, air volume, temperature and heating time of both top and bottom heaters can be adjusted as per requirements. Accurate temperature and even heat distribution can ensure the precision and flexibility of the process.

External 5 K-type sensors, can monitor temperature of PCB and BGA accurately.

Pick-up chips of BGA rework system

Vacuum will generate automatically and pick up BGA chips when the process is finished, then the vacuum will return to original position.


Additional Information

SKU BGA2100
Manufacturer No

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