BGA Rework

Features:

 
1. EA-H15 Infrared reflow soldering section of BGA rework system
Infrared temperature sensor monitors BGA surface temperature directly, realize close loop control, ensure precise temperature technical window and even heat distribution.
2. PL Precise aligning and placing system of BGA rework system
Visible double-colors optical lens alignment, overlap alignment between solder ball and soldering pad is scientific and accurate; easy control, and pick-up and placement.
3. RPC Reflow Camera of BGA rework system
The melting process of BGA solder ball can be observed from different angles, provides critical information to get accurate and reliable process curve.
4. IRsoft Software of BGA rework system
The whole process can be recorded, controlled and analyzed and then generate curve diagram by connecting to PC, can meet the demands of modern electronic industry.

Features:

1. BGA2105 rework system uses excellent heating materials to control the process of BGA soldering and de-soldering process accurately.
2. Large power brushless DC fan, temperature controlled by closed loop sensor and micro computer zero triggering, generate large volume of hot air.
3. Various types of titanium nozzles available, easy replacement.
4. Program can be set to control top and bottom hot air temperature, precise and even.
5. Powerful fan cools bottom heating area rapidly.
6. QUICKSOFT available, easy operation.

Features:

1. No need of nozzles, no airflow during re-flow process.
2. Use non-contact infrared temperature sensor to measure temperature real-timely, and achieve closed loop control of temperature during rework process, especially suitable for lead free process.
3. By reflecting foil to reduce thermal transmission to adjacent components.
4. Camera of BGA Rework System can be used to monitor the re-flow process.
5. No airflow during the process of BGA re-balling, and the success ratio of BGA re-balling can almost be up to 100%.

Features:

1. High automatization, the de-soldering, pick-up and placement of chips can be finished by one button, easy operation.
2. Use large power brushless DC fan, closed loop of sensor and micro-computer zero triggering, can generate large volume of hot air. No need for external air supply, easy operation.
3. Seven temperature areas, suitable for reflex BGA, multilayer BGA and metal shielding case.
4. Integrative design, combines heating system and alignment system together.
5. Visible double-colors optical lens alignment, controlled by rocker, clear and precise.
6. Large power fan, speed adjustable, cool bottom heating area quickly.
7. QUICKSOFT interface, with operation right limitation and profile analysis function available. Can analyze preheating speed, peak temperature, temperature preserving time and cooling rate effectively.
8. Various types of titanium alloy hot air nozzles available, easy replacement.